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How Xiaomi’s 3nm Chip Could Reshape the Global Semiconductor Landscape?

Xiaomi has reportedly achieved a breakthrough by completing China’s first 3-nanometer smartphone chip tape-out without ASML’s EUV technology. This development marks a significant advancement in China’s semiconductor capabilities, challenging U.S. trade restrictions. The achievement follows Xiaomi’s history of chip development since 2017, from the 28nm Surge S1 to specialized processors. With plans to integrate the 3nm chip into the Xiaomi…